功率型发光二极管

PDF Specification

Characteristics

Dimensions Unit:mm(inches)

High Luminous Intensity

Ultra Thermal Performance,Low Thermal Resistance

Fit for Use in SMT Assembly Equipment Infrastructure

Absolute Rating Limits

Parameter	Symbol	Value		Unit
Forward Current	I F	400@1W	150@0.5W	mA
Pulse Forward Current	I FP * 5	700@1W	250@0.5W	mA
Reverse Voltage	V R	5		V
Operating Temperature	Topr.	-30~+85		℃
Storage Temperature	Tstg.	-40~+100		℃
Soldering Temperature	Tsld	Reflowing Soldering： 260 ℃ ＜ 10s
Soldering Temperature	Tsld	Manual Soldering： 350 ℃ ＜ 5s

Absolute Rating Limits

Color	Part No.	Chip materials	λ D (nm)	Φ V（lm)		V F（V）	I F（mA）	2θ 1/2	Power degree	Tc(K）
			Typ.	Min	Typ.	Typ.	Typ.	Typ.		Typ.
Red	NSHL-RNSP1-31	AlGaInP	620	15	20	2.2	120	110 °	0.5W	-
	NSHL-RNSP1-33			30	35		350		1W
Green	NSHL-GNSP1-31	InGaN	520	15	20	3.4	120		0.5W
	NSHL-GNSP1-33			40	50		350		1W
Blue	NSHL-BNSP1-31	InGaN	465	2	4	3.4	120		0.5W
	NSHL-BNSP1-33			4	8		350		1W
Yellow	NSHL-YNSP1-31	AlGaInP	589	10	15	2.3	120		0.5W
	NSHL-YNSP1-33			25	30		350		1W

Color	Part No.	Chip materials	λ D (nm)	Φ V（lm)		V F（V）	I F（mA）	2θ 1/2	Power degree	Tc(K)
			Typ.	Min	Typ.	Typ.	Typ.	Typ.		Typ.
Warm White	NSHL-LNSP1-31	InGaN	x:0.4 y:0.4	15	20	3.2	120	120 °	0.5W	3300K
	NSHL-LNSP1-33			30	40		350		1W
White	NSHL-WNSP1-31	InGaN	x:0.3 y:0.3	20	25	3.2	120		0.5W	6500K
	NSHL-WNSP1-33			40	55		350		1W

Characteristics

Dimensions Unit:mm(inches)

High Luminous Intensity

Ultra Thermal Performance,Low Thermal Resistance

Fit for Use in SMT Assembly Equipment Infrastructure

Absolute Rating Limits

Parameter	Symbol	Value		Unit
Forward Current	I F	400@1W	150@0.5W	mA
Pulse Forward Current	I FP * 5	700@1W	250@0.5W	mA
Reverse Voltage	V R	5		V
Operating Temperature	Topr.	-30~+85		℃
Storage Temperature	Tstg.	-40~+100		℃
Soldering Temperature	Tsld	Reflowing Soldering： 260 ℃ ＜ 10s
Soldering Temperature	Tsld	Manual Soldering： 350 ℃ ＜ 5s

Absolute Rating Limits

Color	Part No.	Chip materials	λ D (nm)	Φ V（lm)		V F（V）	I F（mA）	2θ 1/2	Power degree	Tc（K）
			Typ.	Min	Typ.	Typ.	Typ.	Typ.		Typ.
Red	NSHL-RNSP1-31	AlGaInP	620	15	20	2.2	120	110 °	0.5W	-
	NSHL-RNSP1-33			30	35		350		1W
Green	NSHL-GNSP1-31	InGaN	520	15	20	3.4	120		0.5W
	NSHL-GNSP1-33			40	50		350		1W
Blue	NSHL-BNSP1-31	InGaN	465	2	4	3.4	120		0.5W
	NSHL-BNSP1-33			4	8		350		1W
Yellow	NSHL-YNSP1-31	AlGaInP	589	10	15	2.3	120		0.5W
	NSHL-YNSP1-33			25	30		350		1W

Color	Part No.	Chip materials	λ D (nm)	Φ V（lm)		V F（V）	I F（mA）	2θ 1/2	Power degree	Tc （K）
			Typ.	Min	Typ.	Typ.	Typ.	Typ.		Typ.
Warm White	NSHL-LNSP1-31	InGaN	x:0.4 y:0.4	15	20	3.2	120	120 °	0.5W	3300K
	NSHL-LNSP1-33			30	40		350		1W
White	NSHL-WNSP1-31	InGaN	x:0.3 y:0.3	20	25	3.2	120		0.5W	6500K
	NSHL-WNSP1-33			40	55		350		1W

Characteristics

Dimensions Unit:mm(inches)

High Luminous Intensity

Ultra Thermal Performance,Low Thermal Resistance

Fit for Use in SMT Assembly Equipment Infrastructure

Absolute Rating Limits

Parameter	Symbol	Value		Unit
Forward Current	I F	400@1W	150@0.5W	mA
Pulse Forward Current	I FP * 5	700@1W	250@0.5W	mA
Reverse Voltage	V R	5		V
Operating Temperature	Topr.	-30~+85		℃
Storage Temperature	Tstg.	-40~+100		℃
Soldering Temperature	Tsld	Reflowing Soldering： 260 ℃ ＜ 10s
Soldering Temperature	Tsld	Manual Soldering： 350 ℃ ＜ 5s

Absolute Rating Limits

Color	Part No.	Chip materials	λD (nm)	ΦV（lm)		VF（V）	IF(mA）	2θ1/2	Power degree	Tc（K）
			Typ.	Min	Typ.	Typ.	Typ.	Typ.		Typ.
Red	NSHL-RNSP1-31	AlGaInP	620	15	20	2.2	120	110 °	0.5W	-
	NSHL-RNSP1-33			30	35		350		1W
Green	NSHL-GNSP1-31	InGaN	520	15	20	3.4	120		0.5W
	NSHL-GNSP1-33			40	50		350		1W
Blue	NSHL-BNSP1-31	InGaN	465	2	4	3.4	120		0.5W
	NSHL-BNSP1-33			4	8		350		1W
Yellow	NSHL-YNSP1-31	AlGaInP	589	10	15	2.3	120		0.5W
	NSHL-YNSP1-33			25	30		350		1W

Color	Part No.	Chip materials	λD (nm)	Φ V（lm)		V F（V）	IF（mA）	2θ 1/2	Power degree	Tc（K）
			Typ.	Min	Typ.	Typ.	Typ.	Typ.		Typ.
Warm White	NSHL-LNSP1-31	InGaN	x:0.4 y:0.4	15	20	3.2	120	120 °	0.5W	3300K
	NSHL-LNSP1-33			30	40		350		1W
White	NSHL-WNSP1-31	InGaN	x:0.3 y:0.3	20	25	3.2	120		0.5W	6500K
	NSHL-WNSP1-33			40	55		350		1W