Stock Code: 002449
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1313
1313
1313 Vertical-Structure UVA LED Chip with Ag Mirror and Au-Plated Backside Metallization for Silver Epoxy and Solder Paste Die Attach,high-Brightness for Nail Curing Applications
Product Features
·100% wafer-level testing
·Uniform current distribution
·High brightness
·Low voltage
·Strong reliability
·Long service life
Other Applications
• Nail curing
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Select Image Product Datasheet Chip Type Chip Size(mil) PAD Size(um) N/P PAD Size(um) Reflective layer Thickness (um) Gap(um) Pad Material P/N Pad Material Substrate Material Thickness(um) IF(mA) Imax(mA) Power(mW) Vf(V) WD(nm)
V1313U1 V1313U1 下载 Verticl-Chip 13mil*13mil / / / 160.0 / / Au Si / 100 150 80-170 3.4-4.1 365-375