本产品在小尺寸上集成了高光通、高光效、高显指（CRI）、长寿命等优点，无金线封装，高可靠性，支持 表面贴装技术，其主要作为闪光灯应用于手机、相机产品中。 This compact-size product integrates high luminous flux, superior efficiency, high CRI, and extended lifespan. Featuring gold wire-free packaging, it offers enhanced reliability and SMT (Surface Mount Technology) compatibility. Primarily deployed as a camera flash in mobile phones and digital cameras.
Product Features
• 封装材料：硅树脂 • Encapsulating material：Silicone resin • 焊接方法：无铅回流焊 • Assembly process:Pb-free reflow soldering • 光强高，功耗低，可靠性好，寿命长 • High light intensity, low power consumption, good reliability, long life • 符合欧盟公布的ROHS指令要求 • Compliant with EU RoHS Directive
