Stock Code: 002449
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2222
2222
2222 Vertical-Structure Green LED Chip with Ag Mirror and Au-Plated Backside Metallization for Silver Epoxy and Solder Paste Die Attach,low voltage for Blood oxygen monitoring of smart wearables
Product Features
·100% wafer-level testing
·Uniform current distribution
·High brightness
·Low voltage
·Strong reliability
·Long service life
·High current-carrying capacity
Other Applications
• Smart Wearables • Blood oxygen monitoring
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Select Image Product Datasheet Chip Type Chip Size(mil) PAD Size(um) N/P PAD Size(um) Reflective layer Thickness (um) Gap(um) Pad Material P/N Pad Material Substrate Material Thickness(um) IF(mA) Imax(mA) Power(mW) Vf(V) WD(nm)
V2222G1 V2222G1 下载 Verticl-Chip 22mil*22mil / / / 160.0 / / Au Si / 20 200 14-21.5 2.1-2.6 517.5-537.5