Stock Code: 002449
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3838
3838
3838 Vertical-Structure LED Chip with Ag Mirror and Au-Plated Backside Metallization for Silver Epoxy and Solder Paste Die Attach. Primarily applied in portable lighting,stage lights and related fields.
Product Features
·100% wafer-level testing
·Uniform current distribution
·High brightness
·Low voltage
·Strong reliability
·Long service life
·High current-carrying capacity
Other Applications
• Portable Lighting • Stage Lights
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Select Image Product Datasheet Chip Type Chip Size(mil) PAD Size(um) N/P PAD Size(um) Reflective layer Thickness (um) Gap(um) Pad Material P/N Pad Material Substrate Material Thickness(um) IF(mA) Imax(mA) Power(mW) Vf(V) WD(nm)
V3838A1 V3838A1 下载 Verticl-Chip 38mil*38mil / / / 180.0 / / Au Si / 350 1500 500-570 2.7-3.2 447.5-462.5