• 封装材料:环氧树脂
• Encapsulating material:Epoxy resin
• 焊接方法:无铅回流焊
• Assembly process:Pb-free reflow soldering
• 光强高,功耗低,可靠性好,寿命长
• High light intensity, low power consumption, good reliability, long life
• 符合欧盟公布的ROHS指令要求
• Compliant with EU RoHS Directive
| Select | Image | Product | Datasheet | ForwardCurrent(mA) | Pulse Forward Current | Power Dissipation (mW) | Total Power Dissipation(mW) | Reverse Voltage (V) | Operating Temperature(℃ ) | LuminousIntensity(mcd) | Capacitance(pF) | ColorTemperature(K) | Off-stateOutput TerminalVoltage(V) | Forward Voltage(V) | ESD-HBM(V) | Dominant Wavelength(nm) | VoltageofEmitter-to-Collectorelectrode(V) | VoltageofCollector-to-Emitterelectrode(V) | Moisture resistant Grade(Level) | Electrostatic Discharge(HBM)(V) | PeakWavelength(nm) | MoistureLevel(Leve) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
FC-4428IK-940(ZJ) |
|
100 | 1 | 150 | / | 5 | -25 ~ +85 | / | / | / | / | / | / | / | / | / | / | / | / | / |