Stock Code: 002449
EN / 中
Home
About Us
Product
Application
Research
News
Contact Us
5050
5050
5050 Vertical-Structure LED Chip with Ag Mirror and Au-Plated Backside Metallization for Silver Epoxy and Solder Paste Die Attach.Primarily applied in portable lighting and related fields.
Product Features
·100% wafer-level testing
·Uniform current distribution
·High brightness
·Low voltage
·Strong reliability
·Long service life
·High current-carrying capacity
Other Applications
• Portable Lighting
New Products
Hot Recommended
Parameter Filter
Start Compare
Select Image Product Datasheet Chip Type Chip Size(mil) PAD Size(um) N/P PAD Size(um) Reflective layer Thickness (um) Gap(um) Pad Material P/N Pad Material Substrate Material Thickness(um) IF(mA) Imax(mA) Power(mW) Vf(V) WD(nm)
V5050A1 V5050A1 下载 Verticl-Chip 50mil*50mil / / / 180.0 / / Au Si / 700 2000 1100-1300 2.8-3.2 445-457.5