Stock Code: 002449
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5763
5763
4047 Vertical-Structure LED Chip with Ag Mirror and Low-Void AuSn Eutectic Electrodes,featuring AuSn Back Metallization for Eutectic Bonding.Primarily applied in stage lighting and related fields.
Product Features
·100% wafer-level testing
·Uniform current distribution
·High-Conductivity Molybdenum Substrate
·High brightness
·Low voltage
·Strong reliability
·Long service life
·High current-carrying capacity
Other Applications
• Stage Lights
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Select Image Product Datasheet Chip Type Chip Size(mil) PAD Size(um) N/P PAD Size(um) Reflective layer Thickness (um) Gap(um) Pad Material P/N Pad Material Substrate Material Thickness(um) IF(mA) Imax(mA) Power(mW) Vf(V) WD(nm)
V5763A1 V5763A1 下载 Verticl-Chip 57mil*63mil / / / 150.0 / / P:Au N:AuSn Mo / 1000 6000 95-140 2.8-3.5 445-460