Stock Code: 002449
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6075
6075
5555 Flip-Chip LED Die with ITO/Ag composite reflective film, fully encapsulated barrier structure, center pin protection design, and AuSn low-voiding ratio eutectic electrode technology. Compatible with AuSn eutectic bonding process. Primarily applied in aftermarket automotive lighting and related fields.
Product Features
·100% wafer-level testing
·High brightness
·Long service life
·Uniform current distribution
·Strong reliability
Other Applications
• Aftermarket Automotive Lighting
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Select Image Product Datasheet Chip Type Chip Size(mil) PAD Size(um) N/P PAD Size(um) Reflective layer Thickness (um) Gap(um) Pad Material P/N Pad Material Substrate Material Thickness(um) IF(mA) Imax(mA) Power(mW) Vf(V) WD(nm)
D6075AA D6075AA 下载 Flip-Chip 60mil*75mil / / Silver / 150.0 Gold-Tin Alloy / / 155.0 700 2300 1350-1550 2.6-3.0 445-460