Stock Code: 002449
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8080
8080
8080 Vertical-Structure LED Chip with Ag Mirror,Circular Light-Emitting Surface (LES) and Au-Plated Backside Metallization for Silver Epoxy and Solder Paste Die Attach. Primarily applied in portable lighting and related fields.
Product Features
·100% wafer-level testing
·Uniform current distribution
·High brightness
·Low voltage
·Strong reliability
·Long service life
·High current-carrying capacity
Other Applications
• Portable Lighting
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Select Image Product Datasheet Chip Type Chip Size(mil) PAD Size(um) N/P PAD Size(um) Reflective layer Thickness (um) Gap(um) Pad Material P/N Pad Material Substrate Material Thickness(um) IF(mA) Imax(mA) Power(mW) Vf(V) WD(nm)
V8080A1 V8080A1 下载 Verticl-Chip 80mil*80mil / / / 200.0 / / Au Si / 1000 5000 1300-1600 2.8-3.2 445-460