MIP-CHIP - Nationstar

MIP-CHIP

This product is a surface-mount full-color device, designed with flip-chip technology and a common anode structure. It features a black matte package without specular reflection, and boasts characteristics such as high brightness, high contrast, high reliability, long lifespan, and a wide viewing angle. It is an ideal choice for the field of indoor display and decoration.

Product Features

封装材料:环氧树脂
Encapsulation: Epoxy Resin
焊接方法:无铅回流焊
Soldering methods: Pb-Free reflow soldering
光强高，功耗低，可靠性好，寿命长
High Luminous Intensity ,Low Power Dissipation, Good Reliability and Long Lifespan
高亮度、高对比度、高可靠性、长寿命、宽视角

Other Applications

high-end performing arts rental, government projects, security and protection applications, commercial display and other such fields

Product	芯片/线材(chipWire)	支架(bracket)	测试电流/mA(testCurrent)	亮度典型值/mcd(luminanceTypical)	适用间距(pitchRange)	参考亮度(refLuminance)
MIP-C0404TM	倒装	类BT	2-2-2	25-70-15	P0.6-P1.2	P0.6/45S，3000nit
MIP-C0606TM/	倒装	类BT	2-2-2	26-71-17	P0.9-P1.5	P0.9/45S，2000nit
MIP-C1010TM/MIP-A1010TM	倒装	类BT	2-2-2	32-80-19	P1.2-P2.5	P1.25/45S，1500nit
MIP-C0606WM/MIP-C0606WM	倒装	类BT	2-2-2	47-140-28	P0.9-P1.5	P0.9/45S，3800nit
MIP-C1010TN/MIP-A1010TN	倒装	类BT	2-2-2	30-79-15	P1.2-P2.5	P1.25/45S，1500nit
MIP-C0606TN/MIP-A0606TN	倒装	类BT	2-2-2	27-78-16	P0.9-P1.5	P0.9/45S，2000nit
MIP-C1010WN/MIP-A1010WN	倒装	类BT	2-2-2	125-138-28	P1.2-P2.5	P1.25/45S，3800nit