1. Suitable for module OD (optical distance) from 0 to 22mm, making it easier to achieve thinner and lighter modules, and expanding the application scenarios for end products.  
2. Allows assembly at any angle, enabling multi-shaped light-emitting surfaces.  
3. Developed a variety of COB (Chip-on-Board) high-voltage light source solutions, covering specifications including 6V, 9V, 12V, 18V, and 24V.  
4. Features specialized packaging for light control, with a special spatial light field distribution and a large light-emitting angle, achieving a Pitch/OD ratio of over 3.  
5. The product's manufacturing dimensions are designed to match large-scale designs, reducing the number of panels for TV and providing significant freedom for ultra-thin ID design.  
6. High reliability, long lifespan, and high optical consistency.  
7. 7.Substrate options: Aluminum, FR4, BT, and flexible PCBs.