封装材料:环氧树脂
Encapsulation: Epoxy Resin
焊接方法:无铅回流焊
Soldering methods: Pb-Free reflow soldering
光强高，功耗低，可靠性好，寿命长
High Luminous Intensity ,Low Power Dissipation, Good Reliability and Long Lifespan
高亮度、高对比度、高可靠性、长寿命、宽视角
| 选择 | 图片 | 产品型号 | Datasheet | 芯片/线材(chipWire) | 支架(bracket) | 测试电流/mA(testCurrent) | 亮度典型值/mcd(luminanceTypical) | 适用间距(pitchRange) | 参考亮度(refLuminance) |
|---|---|---|---|---|---|---|---|---|---|
|
FM-B1212RGBA-HF |
|
Au | 铜支架 | 8-5-3 | 45-153-20 | P1.5-P3 | P1.56/32,1200nit | |
|
IMD-F19A-C-N2 |
|
PdCu | 铜支架 | 8-5-3 | 43-126-19 | P1.9 | P1.9/32S,1000nit | |
|
NH-B1212RGBA-HF |
|
PdCu | 铜支架 | 8-5-3 | 41-124-18 | P1.5-P3 | P1.56/32,1000nit |
