封装材料:环氧树脂
Encapsulation: Epoxy Resin
焊接方法:无铅回流焊
Soldering methods: Pb-Free reflow soldering
光强高，功耗低，可靠性好，寿命长
High Luminous Intensity ,Low Power Dissipation, Good Reliability and Long Lifespan
高亮度、高对比度、高可靠性、长寿命、宽视角
| 选择 | 图片 | 产品型号 | Datasheet | 芯片/线材(chipWire) | 支架(bracket) | 测试电流/mA(testCurrent) | 亮度典型值/mcd(luminanceTypical) | 适用间距(pitchRange) | 参考亮度(refLuminance) |
|---|---|---|---|---|---|---|---|---|---|
|
FM-B1415RGBA-SQ |
|
PdCu | 铜支架 | 15-8-5 | 490-555-48 | P2.5-P4 | P2.5/16S,5000nit | |
|
NH-B1415RGBA-SF-C1 |
|
PdCu | 铜支架 | 15-8-5 | 265-338-40 | P2.5-P4 | P2.5/16S3000nit | |
|
FM-B1415RGBA-SH |
|
PdCu | 铜支架 | 15-8-5 | 469-451-60 | P2.5-P4 | P2.5/16S,4000nit |
