封装材料：环氧树脂
Encapsulation: Epoxy Resin
焊接方法：无铅回流焊
Soldering methods: Pb-Free reflow soldering
光强高，功耗低，可靠性好，寿命长
High Luminous Intensity ,Low Power Dissipation,Good Reliability and Long Lifespan
| 选择 | 图片 | 产品型号 | Datasheet | 芯片/线材(chipWire) | 支架(bracket) | 测试电流/mA(testCurrent) | 亮度典型值/mcd(luminanceTypical) | 适用间距(pitchRange) | 参考亮度(refLuminance) |
|---|---|---|---|---|---|---|---|---|---|
|
MIP-AIMD19 |
|
倒装 | 类BT | 5-2-2 | 57-55-10 | P1.9 | 16S,1800nit | |
|
MIP-CIMD15 |
|
倒装 | 类BT | 5-2-2 | 45-45-7 | P1.5 | 16S,1500nit | |
|
|
MIP-AIMD26 |
|
倒装 | 类BT | 5-2-2 | 57-57-12 | P2.6 | 8S,2000nit | |
|
MIP-CIMD12 |
|
倒装 | 类BT | 5-2-2 | 53-55-8 | P1.2 | 32S,1500nit | |
|
MIP-CIMD09 |
|
倒装 | 类BT | 5-2-2 | 32-30-5 | P0.9 | 60S,1000nit | |
|
MIP-CIMD07 |
|
倒装 | 类BT | 5-2-2 | 49-47-8 | P0.7 | 60S,2000nit |
