封装材料:环氧树脂
Encapsulation: Epoxy Resin
焊接方法:无铅回流焊
Soldering methods: Pb-Free reflow soldering
光强高，功耗低，可靠性好，寿命长
High Luminous Intensity ,Low Power Dissipation, Good Reliability and Long Lifespan
高亮度、高对比度、高可靠性、长寿命、宽视角
| 选择 | 图片 | 产品型号 | Datasheet | 芯片/线材(chipWire) | 支架(bracket) | 测试电流/mA(testCurrent) | 亮度典型值/mcd(luminanceTypical) | 适用间距(pitchRange) | 参考亮度(refLuminance) |
|---|---|---|---|---|---|---|---|---|---|
|
GT-C1010RGBT-HF |
|
PdCu | 类BT | 2-2-2 | 27-51-10 | P1.2-P1.5 | P1.25/45S,1000nit | |
|
NH-C1010RGBT-HF-CD |
|
PdCu | 类BT | 2-2-2 | 25-45-6 | P1.2-P2.5 | P2.5/45S,400nit | |
|
IMD-M09-C |
|
PdCu | 类BT | 5-2-2 | 19-37-7 | P0.93 | P0.93/60S,800nit | |
|
GT-B1010RGBT-HE |
|
PdCu | 类BT | 2-2-2 | 22-40-9 | P1.2-P1.5 | P1.25/45S,800nit | |
|
FC-B1010RGBT-HE |
|
Au | 类BT | 2-2-2 | 23-40-6 | P1.2-P1.5 | P1.25/45S,800nit |
